Packaging innovation for space applications - with Texas Instruments

The Space Industry

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7M ago 36:18

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Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments, about the packaging of electronic components for space.

In the episode we cover:

The benefits of using plastic packages vs. ceramic packaging
These include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes
The role that Texas Instruments has played in supporting the standardization of QMLP
How and why TI will continue to offer QMLV-RHA (ceramic) packaging
How TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities

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